Digi Times

GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric and Advanced Process Technologies

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...
Digi Times

Advanced packaging battle intensifies as foundry, OSAT, and PCB sectors enter tripartite era

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in 2025, the advanced ...
Dataquest

Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design

At the 2025 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and ...
New Electronics

Siemens working with TSMC to accelerate 3D IC and AI-driven circuit and systems design

Siemens Digital Industries Software is collaborating with TSMC to deliver product certifications and new design solutions for the foundry’s latest and most advanced process technologies. These various ...
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Intel's Fab 52 is bigger and better equipped than TSMC's Arizona facilities — Intel's production volume dwarfs TSMC's operations in the US

Intel is trying to catch up with TSMC in terms of process technologies and advanced global production capacity, but when it comes to the U.S., the chip giant remains unrivalled. Intel's Fab 52 is more ...
Mena FN

Tomato Processing Market Outlook Report 2025-2034: Market Led By Campbell Soup, J.G. Boswell, Chumak, And Morning Star, Driven By Premium-Quality Produce And Advanced ...

(MENAFN- GlobeNewsWire - Nasdaq) The global tomato processing market is expanding due to rising demand for convenience foods, health benefits, and advancements in processing technologies. Key ...