See more coverage of ITC 2009 at www.tmworld.com/itc. A panel discussion at the 2009 International Test Conference in Austin, TX, (November 1–6) explored a question ...

With integration encompassing not just the logic for a communications chip but also the physical-layer (PHY) analog components, a lot of things get more complicated. It's easy to anticipate the design ...

Telecom test and measurement (T&M) vendor Agilent Technologies today announced the validation of its T3111S NFC Test System for NFC Forum Analog testing. NFC Forum — during its members’ meeting on ...

Modern printed circuit board assemblies (PCBAs) are designed to support increasingly complex applications in industries such as telecommunications, automotive, consumer electronics, and industrial ...

Digilent sells range of development and test platforms including the Analog Discovery Pro 3000 and Analog Discovery Pro 5000 series. In the video, Arthur Brown highlights the company's 3000 and 5000 ...

Foundries and packaging houses are wrestling how to control heat in the testing phase, particularly as devices continue to shrink and as thermally sensitive analog circuits are added into SoCs and ...

30 September 2002Options Efficiently Test Next Generation Mass Storage Drive, Chipset, Datacom and Graphic Devices SAN JOSE - NPTest, a wholly owned subsidiary of Schlumberger Limited (NYSE: SLB) ...

Read about Analog Devices’ condition-based monitoring solutions: analog.com/cbm. Analog Devices, Inc. (ADI) has announced the acquisition of Test Motors, a company ...

Siemens Digital Industries Software today introduced Tessent™ AnalogTest software - an innovative solution that reduces pattern generation time for analog circuit tests from months to days. The ...

Handling waveforms up to 1 Gsample/s, the Analog Waveform Editor with intelligent hard-disk caching enables design and test engineers to rapidly create and edit test signals. It seamlessly integrates ...

Analogic Engineering Inc. of Buford recently received funding to pursue a federal grant that would allow it to develop a portable field test instrument to check metal structures for very small cracks.