In response to the challenges posed by exponential data growth, Vijay Panwar, a senior software engineer at Panasonic Avionics Corporation, conducted research on leveraging stored procedures for ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

TPC are available with unidirectional (UD), fabric and random mat reinforcement in various degrees of impregnation. Fully impregnated forms can be fabricated quickly into final parts but are stiff and ...