Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

IIT Kharagpur's Centre of Excellence in Advanced Manufacturing Technology (CoEAMT) has developed two groundbreaking AI-enabled non-destructive testing projects for weld defect analysis. These ...