A new technical paper titled “Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A Systematic Review” was published by researchers at KU Leuven and imec. “In this ...
Automated DIC imaging with the DM6 M microscope enhances six-inch wafer inspection, providing reproducible results and improved efficiency for defect analysis.
A new technical paper titled “An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspection” was published by Imec and SCREEN SPE Germany. “Deep learning-based semiconductor ...