SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

A new technical paper titled “Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A Systematic Review” was published by researchers at KU Leuven and imec. “In this ...

Automated DIC imaging with the DM6 M microscope enhances six-inch wafer inspection, providing reproducible results and improved efficiency for defect analysis.

Some industry sectors such as automotive and medical continue to push for higher and higher reliability levels; however, many fabs are having difficulties achieving them. Current inspection regimes ...

Diverse optical wafer defect inspection systems including (a) Brightfield/darkfield imaging system, (b) Dark-field imaging with null ellipsometry, (c) Through-focus scanning imaging microscopy, (d) ...

Rigaku Corporation, a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has won the Diana Nyyssonen Memorial Best Paper Award ...

To make the top-of-the-line chips for Apple's iPhone, such as the A14, or Nvidia's A100 series AI processors, with billions of transistors, it takes a factory that costs $16 billion to build and ...

Hyundai Transys has applied the AI technology-based system 'TADA (Transys Advanced Data Analytics)' to its production sites, increasing defect inspection accuracy to 99.9%. The TADA system is a ...