New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

Power modules might be the semiconductor industry’s answer to some constant problems. With advanced component integration, optimization, and performance, modules deliver a power solution that ...

Global electricity demand is rising faster than new large power plants can be built, and the cost of that imbalance is ...

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.

RAM Innovations, a R&D and manufacturing services provider and developer of embedded die packaging (EDP) solutions for electronics manufacturing, has been tasked with playing an essential role in a ...

Infineon Technologies AG has released the next generation of high-density power modules, supporting AI and high-performance data-center compute. Data centers represent two percent of global energy ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) ...

Embedded compute modules based on Qualcomm Dragonwing processors, now support different operating systems, with options including Android, Windows 11 IoT Enterprise, and Yocto Linux. Developed by Tria ...