Abstract: The Ag-epoxy conductive adhesive/Sn-10Pb coating interface was subjected to heat exposure at 150/spl deg/C for up to 1000 hours and the interface degradation was examined by metallurgical ...

To analyze the reinforcement effect of adding polymer to solder paste, epoxies were mixed with two currently available Sn-3.0Ag-0.5Cu (wt.% SAC305) and Sn-59Bi (wt.%) solder pastes and specimens ...

With the rapid development of microelectronics packaging technology, the demand for high-performance packaging materials has further increased. This paper developed novel epoxy-containing ...