Ligentec and X-FAB are expanding their collaboration to further strengthen their integrated photonics offering and streamline ...

LIGENTEC and X-FAB are to jointly bring X-FAB’s XPH90 Silicon Photonics (SOI) technology to market through its integration ...

Paras Defence launched Paras Semiconductor to set up advanced heterogeneous & 3D chip packaging, strengthening India’s ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

IBM's Infrastructure segment profit jumped 53% as AI, hybrid cloud and z17 demand fuel stronger enterprise adoption.

New subsidiary to focus on advanced semiconductor packaging for defence and strategic electronics – Paras would be setting up India’s first advanced heterogeneous & 3D packaging ...

The new subsidiary will be setting up State-of-the-Art Advanced Heterogeneous Packaging and 3D Packaging OSAT (Outsourced Semiconductor Assembly and Testing), with a focus on AI, High Performance ...

Paras Defence and Space Technologies Ltd. on Monday announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking its entry into the semiconductor segment with a focus on advanced ...

With the addition of NVIDIA NVLink Fusion, SiFive computing platforms can connect directly to NVIDIA GPUs and accelerators using a coherent, high-bandwidth interconnect to reduce latency, share data ...

Robots powered by physical AI systems that enable machines to autonomously perceive, understand, reason and interact with the ...

As we move into 2026, the demand for high-performance compute devices, especially for AI data centers, remains robust; ...

Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into ...