Vision Components (VC) will present its new VC MIPI IMX454 Camera Module at SPIE Photonics West, taking place from January ...

IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...

Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the ...

On 2nd January 2026, the Ministry of Electronics and Information Technology (MeitY) approved 22 fresh proposals under the Electronics Components Manufacturing Scheme (ECMS), attracting projected ...

In 2025, several domestic companies entered the Indian smartphone market, but prices rose by year-end, leaving people eager ...

FriendlyELEC has launched the "Plus" variant of the NanoPC-T6 Rockchip RK3588 SBC using up to 32GB LPDDR5, instead of LPDDR4x ...

Goertek, a key player in the extended reality (XR) ecosystem, marked its presence at this year’s CES in Las Vegas, which ...

India’s electronics manufacturing story remains steady, but growth has slowed. Demand drivers are in place, though execution ...

Publicația The Verge, care a avut reporteri la fața locului, a întocmit o listă a celor mai interesante produse de la CES ...

TCL made a bold move for CES 2026. Instead of focusing mainly on RGB LEDs like its competitors, it instead went all in on its ...

Tot mai multe obiective din București-Ilfov folosesc sisteme inteligente: camere IP, control acces pe card/QR, alarme ...