The 3,300- and 2,300-V SiC products from Navitas employ advanced planar device structures and packaging to augment efficiency ...

Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the ...

Penguin Solutions, Inc. a leading provider of high-performance computing and AI infrastructure solutions, today announced ...

South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

Packing elite silicon, a jaw-dropping screen, and some of the most aggressive hardware I've seen in a flagship, Honor's ...

Alpha and Omega Semiconductor Limited ("AOS") (Nasdaq: AOSL) today announced that the company will release its financial results for the fiscal second quarter ended December 31, 2025 on Thursday, ...

SK Hynix demonstrated the industry’s first 16-Hi HBM4 memory package at the trade show, highlighting both the density that ...

On 2nd January 2026, the Ministry of Electronics and Information Technology (MeitY) approved 22 fresh proposals under the Electronics Components Manufacturing Scheme (ECMS), attracting projected ...

EBIX launches a breakthrough Verified Medical Data Platform as part of its EbixONE AI initiative, that lets Universities, ...

But there’s a real difference, and understanding it helps a bunch when you’re trying to figure out what technology actually ...

Early specifications linked to the Avata 360 point to video recording at up to 8K resolution, powered by dual 1/1.1-inch CMOS sensors. If accurate, those larger sensors should deliver stronger ...

Surendra Jaiswal, President of the Federation of Hotel & Restaurant Associations of India (FHRAI), is at the forefront of ...