Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series ...

Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...

Compex has been a Qualcomm Authorized Design Centre (ADC) since 2014, helping customers design specialized, ...

Innodisk, in collaboration with Qualcomm Technologies, launched the AI on Dragonwing series, featuring the EXMP-Q911 module.

Qualcomm Technologies Inc. today debuted the Dragonwing IQ10, a system-on-chip optimized to power humanoid robots. The ...

Innodisk is targeting the growing edge AI market through a joint development with Qualcomm, introducing an 'AI on Dragonwing' ...

The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform ...

Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms SAN ...

See it as part of Qualcomm’s technology showcase at NRF 2026, January 11–13, 2026, at the Javits Center, NYC, Booth ...

Both modules can also work in conjunction with dedicatd high-performance co-processors to deliver 24 TOPS to support complex on-device computing workloads.

South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

At CES 2026, AI is having some of its most significant impact on everyday, existing products, from TVs to PCs, smartphones to ...