Fortec UK has introduced AAEON’s GENE-ARH6 SubCompact Board for AI-driven industrial, maritime and offshore applications. The ...

The full-bridge modules provide high current capabilities of up to 120A and an ultra-low on-resistance down to 8.6mΩ. This combination, coupled with a low thermal resistance of 0.28C/W, maximises ...

Achieving high power density in compact electronic designs presents notable engineering challenges. Electronics’ CSSU2512 current sense resistor manages these demands with an impressive 5W power ...

Amphenol RF has introduced a line of PFAS-free SMA connectors and adapters, expanding its portfolio of high-performance RF interconnect solutions. These products are engineered from PEEK (polyether ...

TECHWAY is pushing these limits by integrating NVIDIA's GPUDirect RDMA technology into its PCIe FPGA platforms, delivering a direct and highly efficient data path between acquisition hardware and GPU ...

The ultra-low RDS (on) values of 4mΩ enable applications that need exceptional static-switching performance, such as eFuse, high-voltage battery disconnect switches, solid-state circuit breakers, and ...

Innodisk has announced its latest GMSL2 Camera Module and Adapter Board Series, designed to deliver long-distance, low-latency, and robust image transmission for demanding edge AI applications.

Menlo Microsystems, Inc. has launched its MM5130-NLX switch, a high-standoff RF front-end protection solution designed for the most demanding aerospace and defence (A&D) applications.

Melexis has announced a new model of the MLX90514, a dual-input inductive sensor interface, tailored for robotics, industrial, and mobility applications. Through its SSI output protocol, it produces ...

Littelfuse, Inc. has launched the TPSMB Asymmetrical Series TVS Diodes (TPSMB2412CA, TPSMB2616CA, TPSMB2818CA, TPSMB3018CA). These first-to-market devices are specifically designed for 12V battery ...

ESP32-H2FHxS SMD Bluetooth SoC from Espressif Systems. The highly integrated wireless MCU is designed to ensure low power consumption and security in connected devices. With a 4mm x 4mm footprint and ...

Renesas Electronics Corporation has introduced the RA6W1 dual-band Wi-Fi 6 wireless MCU, along with the RA6W2 MCU that integrates Wi-Fi 6 and Bluetooth Low Energy technologies. These connectivity ...